Preface.
Editors.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions & Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics Industry.
Chapter 15. Guidelines for Implementing Lead-Free Electronics.
Index.
SANKA GANESAN, PHD, is Associate Research Scientist at the CALCE Electronic Products System Center, University of Maryland. His research interests include advanced materials and interfaces in electronics packages, sensors and MEMS, lead-free electronics, low temperature electronics, and intermittent failures in electronics systems. He has co-authored numerous publications in leading journals and conference proceedings. MICHAEL PECHT, PhD, is Chair Professor, Director, and the founder of the CALCE Electronic Products and Systems Center, University of Maryland. Dr. Pecht is currently Chief Editor of Microelectronics Reliability and has written sixteen books on electronic products development. He has consulted for over fifty major international electronics companies, providing expertise in strategic planning, design, test, IP, and risk assessment of electronic products and systems.
"If you buy only one book on Pb-free electronics to help you prepare for the Big Day, this compilation would be an excellent choice." (Chip Scale Review, March 2006)
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